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深圳supfire為大家講解下CREE LED芯片詳細特點和如何辨別真偽

2012-11-16 11:47:07 jason 133

Q:Cree公司生產紅光LED芯片嗎?

A :Cree公司一直以來都沒有生產紅光LED芯片,隻有藍光、綠光和紫外光LED芯片。
 

Q:Cree的芯片都是碳化矽(SiC)材料為襯底的嗎?
A:目前Cree公司的小功率LED芯片都是采用碳化矽(SiC)材料為襯底的,而EZBright係列LED芯片則采用Si襯底結構。Cree公司是世界上少有采用碳化矽(SiC)材料為襯底生產藍光、綠光和紫外光LED芯片的公司。

 

Q:Cree有沒有雙電極結構的芯片?
A: Cree公司有推出采用碳化矽(SiC)材料為襯底的雙電極結構芯片(ETC係列),型號有TR260、TR2432、TR2436等,以絕緣膠固晶為主,詳情請參考Cree的產品規格書。


Q:Cree的芯片抗靜電能力(ESD)如何?
A:Cree公司的所有采用碳化矽材料為襯底的LED係列芯片的抗靜電能力都大於1000V(HBM),並且是百分之百測試。


Q: LED芯片靜電擊穿現象能夠通過低倍顯微鏡觀察到嗎?

A:通常比較嚴重的靜電擊穿可以通過低倍顯微鏡觀察到在芯片表麵有黑色小孔。

而輕微的靜電擊穿則需要通過高倍顯微鏡或SEM才可以確定


Q:Cree公司的LED芯片在固晶時對銀漿量有何要求?銀漿過多或過少會產生什麽樣的結果?
A:Cree公司建議固晶時銀漿量以芯片高度的1/3處為宜,最多不得超過1/2芯片高度,且芯片四周均有銀漿包圍。銀漿過多,會遮擋芯片側麵出光,導致成品亮度降低,若銀漿溢出到芯片表麵還可能引起短路現象,甚至死燈。銀漿過少,可能會導致接觸不良,成品燈VF值升高或死燈等現象,另外銀漿變質也可能導致上述問題的出現。

 

Q:Cree公司的LED芯片亮度通常用mw表示,請問mw和mcd之間如何換算?
A:Cree芯片的亮度一般用輻射功率RF(Radiant Flux)表示,單位是mw。它表示一個光源單位時間裏發出的光能量,與客戶的測量設備係統相關。而坎德拉(cd)是指單位立體角內的光通量,和封裝的形狀(透鏡形狀)有著很大的關係。兩者的定義和測量方法都不相同, 因此mw和mcd之間無法換算。


Q:為何20mA分選的芯片,在5mA的電流下使用會出現亮度和顏色不均現象?
A:造成這種現象有以下幾種原因:
1、 LED芯片的亮度和波長均會隨電流的變化而變化,且變化是非線性的;對於綠光而言,其波長漂移幅度比藍光的更大。
2、 LED芯片是在20mA恒流條件下分選的,若在恒壓源下並聯工作時,由於每個芯片的VF值不同引起電流分配不均,導致波長和亮度出現較大差異。
關於亮度、波長和電流關係的變化曲線請參考Cree的產品規格書。


Q:芯片中心光軸與支架幾何中心沒有對準會產生什麽影響?
A:這種情況下,對成品而言會出現光強不一致,輻射功率降低,發光不對稱等現象。

 

Q:金球偏離焊盤,會對產品造成什麽影響?
A:金球偏出焊盤有可能會導致VF值升高及漏電產生,特別是雙電極芯片的負電極端,焊線要求更加嚴格


Q:支架杯內壁被汙染,對產品有何影響?
A:若支架內壁有汙染物,將會影響成品亮度,嚴重會影響固晶質量,出現其他異常問題,因此固晶前和固晶後務必保證支架內壁的清潔。

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Q: Cree produced red LED chip it?
A: Cree has been no production of red LED chips, only blue light, green and UV LED chip.
 
Q: Cree chip silicon carbide (SiC) substrate material is it?
A: the Cree small power LED chip and are based on silicon carbide (SiC) material as the substrate, while the the EZBright series LED chip Si substrate structure. The Cree is rare in the world of silicon carbide (SiC) materials for substrate production Blu-ray, green and ultraviolet LED chip companies.
 
Q: Cree dual-electrode structure chip?
A: Cree company introduced its silicon carbide (SiC) material as the substrate electrode structure chip (ETC series), Model TR260, TR2432, TR2436, mainly plastic insulation solid crystal, please refer to Cree's product specifications book.
 
Q: How the Cree chip antistatic capability (ESD)?
A: Cree company's silicon carbide substrate LED chip series antistatic ability are greater than 1000V (HBM), and 100% testing.
 
Q: LED chip electrostatic breakdown phenomenon through low magnification microscope to do?
A: usually more serious electrostatic breakdown can be observed through a low-magnification microscope to the apertures on the chip surface with black.
Slight electrostatic breakdown through a high power microscope or SEM can determine
 
Q: Cree company's LED chip solid crystal silver paste amount requirements? Silver is too much or too little will produce what kind of results?
A: Cree recommended amount of solid crystal when Silver chip 1/3 of the height is appropriate, shall not exceed a maximum of 1/2 chip height, and the chip four weeks have Silver surrounded. Silver excessive, obscures the chip side of the light, resulting in the finished decrease in brightness, may also cause a short circuit if the the silver paste overflow to the surface of the chip, and even dead lights. The silver paste is too small, it may cause poor contact, the VF value of the finished lamp elevated or dead lights and other phenomena, another silver paste deterioration may also result in the aforesaid problem.
 
Q: Cree Company brightness of the LED chip is usually expressed in mw, may I ask how do you convert between mw and mcd?
A: Cree chip brightness generally radiated power RF (Radiant Flux) said that the unit is mw. It represents the energy of the light emitted in a light source unit of time, associated with the customer's measuring equipment system. Candela (cd) is the luminous flux unit solid angle, and shape of the package (lens shape) have a great relationship. Both the definition and measurement methods are not the same, and therefore can not be translated between mw and mcd.
 
Q: Why 20mA sorting chips, 5mA current inequality of brightness and color?
A: This phenomenon several reasons:
1, the brightness of the LED chip and the wavelength will change with the current change, and the change is nonlinear; For green purposes, its wavelength shift magnitude greater than that of blue.
2, LED chip 20mA constant current conditions under separation, under constant voltage source in parallel work, caused by the uneven distribution of current VF value of each chip, wavelength and brightness appear quite different.
Curve Cree's product specifications please refer to changes in brightness, wavelength and current relationship.
 
Q: geometric center of the center of the chip optical axis bracket is not aligned with what impact?
A: In this case, the terms of the finished product appears light intensity is inconsistent, the radiation power is reduced, the light emitting asymmetric phenomenon.
 
Q: golden goal off the pad, what impact will the product?
A: gold ball misses pad may cause elevated VF value and the drain generated double electrode, a negative electrode terminal of the chip, bonding wires more stringent requirements
 
Q: the inner wall of the stent Cup pollution, and the impact of the products?
A: If the the bracket inner wall contaminants will affect the finished product brightness will seriously affect the quality of the solid crystal, other unusual problems, so sure and solid crystal solid crystal before stent wall clean.

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